专利名称：Integrated circuits and method of producing
the same
发明人：Charlotte Raetzel,Jenoe Tihanyi申请号：US05/333334申请日：19730216公开号：US04017769A公开日：19770412
摘要：An integrated circuit formed on the surface of an insulating substrate is
provided with an overlying conductive layer interconnecting the integrated circuit with anexternal electrode, and an intermediate layer of insulating material is interposedbetween the conductive layer and the substrate.
申请人：SIEMENS AKTIENGESELLSCHAFT
代理机构：Hill, Gross, Simpson, Van Santen, Steadman, Chiara & Simpson
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