METHOD AND APPARATUS FOR IMPROVING THE RELIABILITY

专利名称：METHOD AND APPARATUS FOR

IMPROVING THE RELIABILITY OF ACONNECTION TO A VIA IN A SUBSTRATE

发明人：Long-Ching Wang,Albert Wu,Scott Wu申请号：US14613218申请日：20150203

公开号：US20150228569A1公开日：20150813

专利附图：

摘要：Some of the embodiments of the present disclosure provide a semiconductorpackage interposer comprising a substrate having a first surface and a second surface, a

plurality of vias extending between the first surface and the second surface of thesubstrate, the plurality of vias electrically connecting electrical connectors or circuitry onthe first surface of the substrate to electrical connectors or circuitry on the secondsurface of the substrate, and metal plugs at least partially filling the plurality of vias. Atleast one of (i) the first surface or (ii) the second surface of the substrate includesdepressions at distal ends of the metal plugs.

申请人：Marvell World Trade Ltd.

地址：St. Michael BB

国籍：BB

更多信息请下载全文后查看