专利名称：Method of locating conductive spheres
utilizing screen and hopper of solder balls
发明人：Chad A. Cobbley,Michael B. Ball,Marjorie L.
Waddel
申请号：US10357825申请日：20030203公开号：US07105432B2公开日：20060912
专利附图：
摘要：Methods for placing conductive spheres on prefluxed bond pads of a substrateusing a stencil plate with a pattern of through-holes positioned over the bond pads.
Conductive spheres are placed in the through-holes by a moving feed mechanism and thespheres drop through the through-holes onto the bond pads. In one embodiment, thefeed mechanism is a sphere hopper which crosses the entire through-hole pattern. Inanother embodiment, a shuttle plate fed spheres from a reservoir and reversibly movesabout one-half of the pitch, moving from a non-discharge position to a discharge position.
申请人：Chad A. Cobbley,Michael B. Ball,Marjorie L. Waddel
地址：Boise ID US,Boise ID US,Boise ID US
国籍：US,US,US
代理机构：TraskBritt, PC
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