专利名称：Thermally enhanced packaged
semiconductor assemblies
发明人：Thomas H. Distefano申请号：US08/740856申请日：19961104公开号：US06075289A公开日：20000613
摘要：A thermally enhanced semiconductor package includes a sheet metal caphaving flexible flanges provided with solder contacts for reliable attachment to a circuitboard. The package assembly further includes a semiconductor chip with a contact-bearing front surface facing forwardly, and chip bonding contacts overlying the front faceof the chip. The flange bonding contacts are coplanar with the chip bonding contacts, orcan be brought into coplanar alignment by flexure of the cap. The package can besurface-mounted to a circuit board by placing the package onto pads of solder paste,and then heating the assembly to melt the solder paste in order to join the bondingcontacts on the chip and on the flange to corresponding contacts on the circuit board.
申请人：TESSERA, INC.
代理机构：Lerner, David, Littenberg, Krumholz & Mentlik, LLP
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容