专利名称：Method of manufacturing connection
structure
发明人：Ryoji Kojima申请号：US14112277申请日：20120402公开号：US09318353B2公开日：20160419
专利附图：
摘要：A method of manufacturing a connection structure which includes a wiringsubstrate, a first electronic component that is flip-chip mounted on the front surfacethereof, and a second electronic component that is flip-chip mounted on the rear surface.
The method includes the steps of: temporarily mounting the first electronic componenton the front surface of the wiring substrate with a first adhesive film disposedtherebetween; temporarily mounting the second electronic component on the rearsurface of the wiring substrate with a second adhesive film disposed therebetween,placing, on a pressure bonding receiving base, the wiring substrate on which the firstelectronic component and the second electronic component are temporarily mounted;and mounting the first electronic component and the second electronic component at atime onto the respective front and rear surfaces of the wiring substrate.
申请人：Ryoji Kojima
地址：Tochigi JP
国籍：JP
代理机构：Oliff PLC
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