专利名称：Chemical Mechanical Polishing Slurries, Their
Applications and Method of Use Thereof
发明人：Chris Chang Yu,Andy Chunxiao Yang,Danny
Zhenglong Shiao
申请号：US11918956申请日：20060419
公开号：US20080190894A1公开日：20080814
摘要：This invention disclosed a chemical mechanical polishing slurry, which includes atleast one abrasive particle, an oxidant and a carrier. The oxidant is combined with a bigmetallorganic compound; and the applications and corresponding handling method arealso disclosed. This invention slurry can realize high removal rate, no corrosion, lowdefectivity and high plan
申请人：Chris Chang Yu,Andy Chunxiao Yang,Danny Zhenglong Shiao
地址：Shanghai CN,Shanghai CN,Shanghai CN
国籍：CN,CN,CN
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