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Magnetic induction coil for semiconductor devices

来源:伴沃教育
专利内容由知识产权出版社提供

专利名称:Magnetic induction coil for semiconductor

devices

发明人:Kazuo Matsuzaki申请号:US08/512260申请日:19950807公开号:US05519582A公开日:19960521

摘要:A magnetic induction coil is mounted directly on and integrated with asemiconductor wafer containing integrated circuitry for a stable power source. Groovesare etched in the reverse face of the wafer substrate, an insulating film is applied, andconducting material fills the grooves, forming the coil. The coil conductors are connectedwith wiring conductors from the opposite side through protruding electrodes.

申请人:FUJI ELECTRIC CO., LTD.

代理机构:Finnegan, Henderson, Farabow, Garrett & Dunner

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